Dongjin develops, manufactures and markets chemical mechanical polishing (CMP) slurries. These slurry materials are used in polishing wafers,
a necessary step in providing a smooth surface for the following layer of circuitry in the manufacture of chips.
In addition to providing CMP slurries for the mainstay silicon and aluminum wafer markets, Dongjin has expertise in the new copper slurry technology.


DSO series are chemical mechanical polishing (CMP) slurries for oxide layers, composed of 12 wt% high purity fumed silica stabilized by a potassium hydroxide.


DSW series are chemical mechanical polishing (CMP) slurries for tungsten, titanium and oxide layers. They are composed of high purity fumed silica or alumina.


DST series are chemical mechanical polishing (CMP) slurries for STI process, which offers a high selectivity and extremely low defect count.