PhotoresistㆍThinnerㆍCMP SlurryㆍBottom Anti-reflective CoatingㆍHardmaskㆍPrecursorㆍMelamine Mold Cleaner

Photoresist (PR)

Photoresist (PR) is a chemical that changes properties when exposed to certain wavelengths of light to form desired patterns of coating on substrate surfaces. PR serves as key material for the photolithography of semiconductor circuits in the manufacturing process. We manufacture a wide range of high quality PR.

Thinner

Semiconductor thinner is used in the Edge Bead Removal (EBR) process to remove unwanted photoresist on the edge of a silicon wafer after photoresist spin coating. It is also used to reduce photoresist dispensing volume in the Resist Reduced Coating (RRC) process. Our specially formulated thinner can effectively reduce PR volume by up to 50% in comparison to normal thinners as well as reduce hump height to improve yield.

Chemical Mechanical Polishing (CMP) Slurry

CMP Slurry is the process in which CMP slurry is applied to a silicon wafer for planarization and removal of film/coating material. Depending on the quality of the film to be polished, products are divided into two classes of either oxide or metal slurry and further subdivided according to the type of abrasive material in the slurry.

Bottom Anti-reflective Coating (BARC)

BARC is applied prior to the application of PR. BARC prevents PR pattern distortion caused by standing waves and notching caused by absorption of light scattered or reflected from substrates during the photolithography process to allow for precise micro and nanoscale pattern formation. Dongjin Semichem provides different BARCs for various wavelength applications.

Spin-on-carbon (SOC) Hardmask

As PR film thickness decreases to realize microcircuits with smaller feature size requirements, PR cannot independently serve as a mask for etch processes. Specially formulated to serve as a hardmask for etch masking, SOC Hardmask is a spin-coatable material suitable for next-generation semiconductor manufacturing processes.

Precursors

Precursors are used to prepare various thin films on Si wafer substrates through chemical vapor deposition (CVD) or atomic layer deposition (ALD) processes. Dongjin Semichem develops and supplies Si and metal precursors of ultra-high purity.

Melamine Mold Cleaner (MMC)

MMC is used to effectively remove foreign substances (impurities, carbonized substances, etc.) that occur during the process of applying epoxy molding compounds (EMCs), which protect semiconductor packages such as integrated circuits (ICs) and diodes from external impact.

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